School of Data Science
Innovative Design and Artificial Intelligence
JUPAS No. Not Applicable
Year of Entry First Year Entry
Funding Type Self-financed
Innovative Design + AI : Hardware-Software Integration
The Bachelor of Science (Honours) in Innovative Design and Artificial Intelligence (BScIDAI) is a self-financed programme designed to bridge the gap between creative innovation and technical execution. The BScIDAI self-financed programme fuses holistic design thinking with advanced AI engineering. Graduates emerge fully prepared to independently develop and deploy market-ready intelligent products across evolving industries.
Programme Highlight
Interdisciplinary Integration: Design & AI
The curriculum merges innovative design methodologies with artificial intelligence. This interdisciplinary approach bridges the gap between innovative thinking and technical rigour, cultivating professional talent for digital innovation.
Holistic System Engineering
Focusing on hardware-software integration, the programme covers system design, verification, and validation. This pillar ensures mastery in technical environments that require a seamless blend of software engineering and physical system integration.
Experiential Learning & Capstone Prototyping
The programme emphasises project-based learning and Capstone design challenges. Theoretical study is directly applied to functional prototyping and real-world deployment, ensuring graduates are equipped for professional industry standards.
Scholarship and Internship
The University and the School of Data Science offers a wide range of scholarships to students pursuing the BScIDAI programme who demonstrate exceptional academic achievement or have made outstanding contributions to society.
The programme works closely with its extensive network of academic and industry partners across the Greater Bay Area to provide students with a rich and impactful learning experience at Lingnan University. Students have access to a wide range of opportunities, including internships, study tours, and work placements in sectors such as aerospace, innovation and technology, healthcare, and electronic interconnection, enabling them to gain valuable industry exposure and practical experience.
