學生事務處

就業諮詢服務

Next Step Connections

Summer Internship Programme 2026 (Korea/ Vietnam)

Internship Partner:Next Step Connections
Locations:Korea (Seoul), Vietnam (Saigon)
Duration:12 June 2026 – 25 July 2026 (6 weeks)
Compensation:Unpaid
Programme Fee:HKD19,800 for Saigon, Vietnam
HKD22,800 for Seoul, Korea
Inclusive Items:Inclusive of accommodation, airport pickup, cultural activities, internship arrangement, pre-internship training and public transport allowance
(Airfare, daily expenses and visa application fee, if any, are to be paid by students)
Subsidies:1. Overseas Internship Subsidy: 
HKD10,000 for 6-week internship
2. First Generation University Education Fund: 
up to HKD5,000 for full-time students who are the first generation in their families receiving university education with financial need (See below for the application method)
Application Deadline:31 Jan 2026
Application Method:

Directly submit your application to Next Step Connections HERE

  • The application fee of $88 USD can be waived by using the code LINGSP26. 
  • Once your application is received, Next Step Connections will conduct a screening process and may contact you during this time. 
  • If your application is successful, you will be required to pay a non-refundable deposit of $150 USD to proceed.
  • Upon payment of the deposit, Next Step will initiate the company matching process, and further interview arrangements between you and the company may be organized based on the company's requirements.
  • If you accept the offer, you will then need to pay the remaining program fees.

Programme Timeline

Application Method for the OSA Subsidy and First Generation University Education Fund

  • The approved internship partners will provide OSA with a complete list of students applying for the subsidy.
  • OSA will approach the students about applying for the subsidy.

Enquiries

Ms. Cynthia Lam
Tel: 2616-8653
Email: [email protected]		Ms. Sarah Lee
Tel: 2616-7306
Email: [email protected]