Subsite Background

HKSTP Tech FYP Sponsorship



The Tech FYP Sponsorship Programme is a new programme by Hong Kong Science and Technology Park (HKSTP), aimed at providing support to final year students to pursue the commercialisation of their final-year project (FYP) or capstone project.


Support provided

  • Seed funding of up to HKD100,000: provided by HKSTP based on milestone accomplishment
  • Capacity-building resources including but not limited to trainings and workshops in both business management as well as selected technical competencies
  • Coaching, mentorship, and network
  • Opportunity to be admitted to the 3-year HKSTP Incubation Programme with up to HKD1.29mil funding support and office space



  • Final year students (undergraduate and full-time postgraduate) undertaking final year projects or capstone projects
  • Alumni who have recently graduated within 2023 are also welcomed
  • Individual with HKID or a HK registered company established for less than 2 years



Projects will be evaluated based on: 

  • Business and market potential
  • R&D element
  • Innovativeness
  • Individual or team competency



Application to HKSTP is through nomination by Lingnan University, by way of LEI. 

Submit your application here as well as a pitch deck (template found here). 

The internal submission deadline is on 27 October 2023

Shortlisted teams will be invited to a vetting by LEI from 30 October to 1 November 2023


Important Dates from HKSTP

Nomination by University October to November 2023
Nomination deadline & FYP proposal submission 3 November 2023
Shortlisting by HKSTP 6 to 10 November 2023
Panel assessment 16 to 17 November 2023
Result announcement 20 November 2023
Submission of HKSTP ideation application 30 November 2023
Programme kick-off January 2024


For more information, please contact the Programme Coordinator at 2616-8067 (Ms Aka Tsang) or through email at [email protected]